The light is on, but the heat is off
Our functionally integrated LED flashlight convincingly demonstrates the joint developments, creativity and courage to explore new options, producing a more cost-efficient product with higher performance.
In our case, excellent heat management guarantees the highest LED lifetimes possible. The heat generated by the LED is spread by the printed circuit board and efficiently dissipated by highly thermally conductive polymers.
The choice of a new material combination of polymers and 3M™ Boron Nitride Cooling Filler opens up freedom of design and reduces the number of manufacturing steps and components. The good flow and molding properties of the Boron Nitride-filled compound allow manufacturing in one shot and direct over-molding of electronic parts. This simpler processing route drastically cuts back investment costs. Development times are dramatically shortened as well, with system costs lowered by up to 30 % compared with existing solutions.
Apart from that, the new material combination of polymers and 3M™ Boron Nitride Cooling Filler opens up new methods of product design: fewer components, smaller parts and more complex geometries.
The idea behind it, however, is not limited to use in LED applications alone. It can be applied to all E&E applications in which increased heat spreading is necessary.
Is the future generation of products just around the corner?
Our team of experts will support you in the implementation of new product ideas or optimization of existing designs with their experience and know-how.
Please contact us!
Need more information?Click on the logos below to learn more about 3M™ Boron Nitride Cooling Fillers, Häusermann printed circuit boards, Lehmann & Voss made-to-measure compounds, OSRAM LEDs or injection molding by RF Plast.